Ultrasonic Soldering System

You're looking at a photo of the System 35 that produces strong, non-porous bonds in a wide variety of materials - without using flux.

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Fibra-Sonics Ultrasonic Soldering System consists of an automatically tuned power generator (G-35), the vibrator tool-head (T-35), soldering tips (H-2, H-3, H-4 or H5), and a footswitch.

Ultrasonic soldering applications include the semi-conductor and microwave fields and other fields un which the corrosive effects of fluxes are an ever-presenr problem. The fluxless principle is one of the best means for reducing corrosion and increasing the durability of soldered joints. High temperature applications, extremely troublesome with flux methods due to carbonization and corrosion, are solved by ultrasonic soldering.

One of the major applications of fluxless soldering is in the elimination of the cleaning, post treatment and neutralizing procedures necessary to remove the flux residue in normal solder operation.

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weitere Informationen unter:

www.sonicsolder.com

 

 

The following is a partial list of materials, which can be satisfactorily soldered without the use of flux:

SOLDERABLE MATERIALS Aluminum Niobium
  Ceramics Nickel and its alloys
  Copper and its alloys Semiconductor material
  Glass (including borsilicate glass) Silicon
  Germanium Silver
  Gold Sodium Trichloride
  Lead Steel
  Magnesium Tin
  Zinc  

Soldering Tips

There are four types of tips:

hexacon1.jpg (4217 Byte) H-2
H-3
H-4
H-5
1/8" Cone shape
3/16" Pyramid shape
3/16" Chisel shape
1/4" Chisel shape

 

MBR ELECTRONICS GmbH
Jonastrasse 8, CH-8636 WALD / ZH, SWITZERLAND
Tel: 055-246 24 00, Fax: 055-246 24 18, E-Mail: info@mbr.ch

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