DEN-ON Instruments Ltd.

diclog.gif (1873 Byte)

DS-500        

SMD Microscope for BGA / CSP / QFP / PLCC

ds500.jpg (35618 Byte)

This Microscope is designed specifically for the inspection of nearly all Surface Mount Devices including BGA, GSP, Flip Chip, QFP, PLCC and chip packages.

Designed with a feature set that makes it easy to operate, simple to maneuver and overall.

Overall design is high quality and low cost.

cracked solder joint.jpg (13135 Byte)

lifted ball.jpg (11955 Byte)

missing solder ball.jpg (12464 Byte)

solder bridge between balls.jpg (14081 Byte)

Linear motion of the inspection head allows for continuos inspection of multiple solder joints.

A lens camber adjustement allows for viewing of the upper, lower and surface of the solder balls in Area Array devices.

The unique combination of brilliant white LED lightning and specially shaped prismatic lens allow for clear crisp view for inspection.

Compared with the halogen lightning systems currently on the market, the unique low wattage (7 W) LED have nearly infinite lifetime.

J lead solder joint.jpg (10829 Byte)

gullwing solder joint.jpg (9945 Byte)

smt chip cap.jpg (9712 Byte)

smt chip resistor.jpg (12101 Byte)

 

MBR ELECTRONICS GmbH
Jonastrasse 8, CH-8636 WALD / ZH, SWITZERLAND
Tel: 055-246 24 00, Fax: 055-246 24 18, E-Mail: info@mbr.ch

HOME